Thermal repeatability and in-situ showerhead temperature monitoring

ABSTRACT

Embodiments described herein generally related to a substrate processing apparatus, and more specifically to an improved showerhead assembly for a substrate processing apparatus. The showerhead assembly includes a gas distribution plate and one or more temperature detection assemblies. The gas distribution plate includes a body having a top surface and a bottom surface. The one or more temperature detection assemblies are interfaced with the top surface of the gas distribution plate such that a thermal bond is formed between the gas distribution plate and each of the one or more temperature detection assemblies. Each temperature detection assembly includes a protruded feature and a temperature probe. The protruded feature is interfaced with the top surface of the gas distribution plate such that an axial load is placed on the gas distribution plate along an axis of the protruded feature. The temperature probe is positioned in a body of the protruded feature.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims benefit of United States Provisional ApplicationSer. No. 62/424,197, filed Nov. 18, 2016 (Attorney Docket No.APPM/24583USL), of which is incorporated by reference in its entirety.

BACKGROUND Field

Embodiments described herein generally related to a substrate processingapparatus, and more specifically to an improved showerhead assembly fora substrate processing apparatus.

Description of the Related Art

Semiconductor processing systems that perform “dry” etching ofsemiconductor substrate via plasmic gases, also known as reactive ionetching (RIE) require constant monitoring. While it is possible topredefine the etch parameters and allow the systems to perform the etchprocess unmonitored, conditions within the systems can change over time.For example, monitoring a temperature of a showerhead assembly for asubstrate processing apparatus aids in providing temperature feedbackthat can aid in maintaining stable process control. Minute changes inthe composition or pressure of an etch gas or process chamber orsubstrate temperature creates undesirable etch results.

Therefore, there is a need for an increase showerhead assembly for asubstrate processing apparatus.

SUMMARY

Embodiments described herein generally related to a substrate processingapparatus, and more specifically to an improved showerhead assembly fora substrate processing apparatus. The showerhead assembly includes a gasdistribution plate and one or more temperature detection assemblies. Thegas distribution plate includes a body having a top surface and a bottomsurface. The one or more temperature detection assemblies are physicallyinterfaced with the top surface of the gas distribution plate. Eachtemperature detection assembly includes a protruded feature and atemperature probe. The protruded feature is in contact with the topsurface of the gas distribution plate. The temperature probe ispositioned in the protruded feature.

In another embodiment, a processing chamber is disclosed herein. Theprocessing chamber includes a substrate support member and a shower headassembly. The substrate support member is configured to support asubstrate. The showerhead assembly includes a gas distribution plate andone or more temperature detection assemblies. The gas distribution plateincludes a body having a top surface and a bottom surface. The one ormore temperature detection assemblies are interfaced with the topsurface of the gas distribution plate. Each temperature detectionassembly includes an axially loaded protruded feature and a temperatureprobe. The protruded feature is bonded to the top surface of the gasdistribution plate. The temperature probe is positioned in the protrudedfeature.

In another embodiment, a method of processing a substrate is disclosedherein. A plasma is formed in a processing region of a processingchamber. The processing region is defined between a showerhead assemblyand a substrate support assembly. The showerhead assembly includes a gasdistribution plate. The substrate support assembly is configured tosupport the substrate. The temperature of the gas distribution plate ismonitored with a temperature detection assembly. The temperaturedetection assembly is interfaced with the top surface of the gasdistribution plate such that a thermal bond is formed between the gasdistribution plate and the temperature detection assembly. Thetemperature detection assembly includes a protruded feature and atemperature probe. The protruded feature is interfaced with the topsurface of the gas distribution plate such that an axial load is placedon the gas distribution plate along an axis of the protruded feature.The temperature probe is supported by the protruded feature. Thetemperature probe is configured to monitor a temperate of the gasdistribution plate. The process recipe is then adjusted based on thetemperature monitored by the temperature detection assembly.

BRIEF DESCRIPTION OF THE DRAWINGS

So that the manner in which the above recited features of the presentdisclosure can be understood in detail, a more particular description ofthe disclosure, briefly summarized above, may be had by reference toembodiments, some of which are illustrated in the appended drawings. Itis to be noted, however, that the appended drawings illustrate onlytypical embodiments of this disclosure and are therefore not to beconsidered limiting of its scope, for the disclosure may admit to otherequally effective embodiments.

FIG. 1 illustrates a cross sectional view of a processing chamber,according to one embodiment.

FIG. 2 illustrate a partial cross sectional view of the showerheadassembly of FIG. 1, according to one embodiment.

FIG. 3A illustrates a top view of the gas distribution plate of FIGS. 1and 2, according to one embodiment.

FIG. 3B illustrates a top view of the gas distribution plate of FIGS. 1and 2, according to one embodiment.

FIG. 4 illustrates a top view of the showerhead assembly of FIGS. 1 and2, according to one embodiment.

For clarity, identical reference numerals have been used, whereapplicable, to designate identical elements that are common betweenfigures. Additionally, elements of one embodiment may be advantageouslyadapted for utilization in other embodiments described herein.

DETAILED DESCRIPTION

FIG. 1 is a cross sectional view of a processing chamber 100 having animproved showerhead assembly 150, according to one embodiment. As shown,the processing chamber 100 is an etch chamber suitable for etching asubstrate, such as substrate 101. Examples of processing chambers thatmay be adapted to benefit from exemplary embodiments of the disclosureare Sym3® Processing Chamber, and Mesa™ Processing Chamber, commerciallyavailable from Applied Materials, Inc., located in Santa Clara, Calif.It is contemplated that other processing chambers, including those fromother manufacturers, may be adapted to benefit from exemplaryembodiments of the disclosure.

The processing chamber 100 may be used for various plasma processes. Inone embodiment, the processing chamber 100 may be used to perform dryetching with one or more etching agents. For example, the processingchamber may be used for ignition of plasma from a precursor C_(x)F_(y)(where x and y can be different allowed combinations), O₂, NF₃, orcombinations thereof.

The processing chamber 100 includes a chamber body 102, a lid assembly104, and a support assembly 106. The lid assembly 104 is positioned atan upper end of the chamber body 102. The support assembly 106 isdisclosed in an interior volume 108, defined by the chamber body 102.The chamber body 102 includes a slit valve opening 110 formed in asidewall thereof. The slit valve opening 110 is selectively opened andclosed to allow access to the interior volume 108 by a substratehandling robot (not shown) for substrate transfer.

The chamber body 102 may further include a liner 112 that surrounds thesupport assembly 106. The liner 112 is removable for servicing andcleaning. The liner 112 may be made of a metal such as aluminum, aceramic material, or any other process compatible material. In one ormore embodiments, the liner 112 includes one or more apertures 114 and apumping channel 116 formed therein that is in fluid communication with avacuum port 118. The apertures 114 provide a flow path for gases intothe pumping channel 116. The pumping channel 116 provides an egress forthe gases within the chamber 100 to vacuum port 118.

A vacuum system 120 is coupled to the vacuum port 118. The vacuum system120 may include a vacuum pump 122 and a throttle valve 124. The throttlevalve 124 regulates the flow of gases through the chamber 100. Thevacuum pump 122 is coupled to the vacuum port 118 disposed in theinterior volume 108.

The lid assembly 104 includes at least two stacked components configuredto form a plasma volume or cavity therebetween. In one or moreembodiments, the lid assembly 104 includes a first electrode (“upperelectrode”) 126 disposed vertically above a second electrode (“lowerelectrode”) 128. The upper electrode 126 and the lower electrode 128confine a plasma cavity 130, therebetween. The first electrode 126 iscoupled to a power source 132, such as an RF power supply. The secondelectrode 128 is connected to ground, forming a capacitor between thetwo electrodes 126, 128. The upper electrode 126 is in fluidcommunication with a gas inlet 134. The first end of the one or more gasinlets 134 opens into the plasma cavity 130.

The lid assembly 104 may also include an isolator ring 136 thatelectrically isolates the first electrode 126 from the second electrode128. The isolator ring 136 may be made from aluminum oxide or any otherinsulative, processing compatible, material.

The lid assembly 104 may also include showerhead assembly 150 and,optionally, a blocker plate 140. The showerhead assembly 150 includes agas distribution plate 138, a gas plate 139, and a chill plate 151. Theshowerhead assembly 150 is discussed in more detail in conjunction withFIGS. 2-3 below. The second electrode 128, the gas distribution plate138, the chill plate 151, and the blocker plate 140 may be stacked anddisposed on a lid rim 142, which is coupled to the chamber body 102.

In one or more embodiments, the second electrode 128 may include aplurality of gas passages 144 formed beneath the plasma cavity 130 toallow gas from the plasma cavity 130 to flow therethrough. The gasdistribution plate 138 includes a plurality of apertures 146 configuredto distribute the flow of gases therethrough. The blocker plate 140 mayoptionally be disposed between the second electrode 128 and the gasdistribution plate 138. The blocker plate 140 includes a plurality ofapertures 148 to provide a plurality of gas passages from the secondelectrode 128 to the gas distribution plate 138.

The support assembly 106 may include a support member 180. The supportmember 180 is configured to support the substrate 101 for processing.The support member 180 may be coupled to a lift mechanism 182 through ashaft 184, which extends through a bottom surface of the chamber body102. The lift mechanism 182 may be flexibly sealed to the chamber body102 by a bellows 186 that prevents vacuum leakage from around the shaft184. The lift mechanism 182 allows the support member 180 to be movedvertically within the chamber body 102 between a lower transfer portionand a number of raised process positions. Additionally, one or more liftpins 188 may be disposed through the support member 180. The one or morelift pins 188 are configured to extend through the support member 180such that the substrate 101 may be raised off the surface of the supportmember 180. The one or more lift pins 188 may be active by a lift ring190.

The processing chamber may also include a controller 191. The controller191 includes programmable central processing unit (CPU) 192 that isoperable with a memory 194 and a mass storage device, an input controlunit, and a display unit (not shown), such as power supplies, clocks,cache, input/output (I/O) circuits, and the liner, coupled to thevarious components of the processing system to facilitate control of thesubstrate processing.

To facilitate control of the chamber 100 described above, the CPU 192may be one of any form of general purpose computer processor that can beused in an industrial setting, such as a programmable logic controller(PLC), for controlling various chambers and sub-processors. The memory194 is coupled to the CPU 192 and the memory 194 is non-transitory andmay be one or more of readily available memory such as random accessmemory (RAM), read only memory (ROM), floppy disk drive, hard disk, orany other form of digital storage, local or remote. Support circuits 196are coupled to the CPU 192 for supporting the processor in aconventional manner. Charged species generation, heating, and otherprocesses are generally stored in the memory 194, typically as softwareroutine. The software routine may also be stored and/or executed by asecond CPU (not shown) that is remotely located from the processingchamber 100 being controlled by the CPU 192.

The memory 194 is in the form of computer-readable storage media thatcontains instructions, that when executed by the CPU 192, facilitatesthe operation of the chamber 100. The instructions in the memory 194 arein the form of a program product such as a program that implements themethod of the present disclosure. The program code may conform to anyone of a number of different programming languages. In one example, thedisclosure may be implemented as a program product stored on acomputer-readable storage media for use with a computer system. Theprogram(s) of the program product define functions of the embodiments(including the methods described herein). Illustrative computer-readablestorage media include, but are not limited to: (i) non-writable storagemedia (e.g., read-only memory devices within a computer such as CD-ROMdisks readable by a CD-ROM drive, flash memory, ROM chips, or any typeof solid-state non-volatile semiconductor memory) on which informationis permanently stored; and (ii) writable storage media (e.g., floppydisks within a diskette drive or hard-disk drive or any type ofsolid-state random-access semiconductor memory) on which alterableinformation is stored. Such computer-readable storage media, whencarrying computer-readable instructions that direct the functions of themethods described herein, are embodiments of the present disclosure.

FIG. 2 illustrates a partial cross sectional view of the showerheadassembly 150, according to one embodiment. The showerhead assembly 150includes the gas distribution plate 138, the gas plate 139 positioned ona top surface of the gas distribution plate 138, and the chill plate 151positioned on a top surface of the gas plate 139. The gas distributionplate 138 includes a body 202 having a top surface 204 and a bottomsurface 206. The bottom surface 206 faces the processing region of theprocessing chamber 100. One or more through holes 208 are formed throughthe body 202, extending from the top surface 204 to the bottom surface206. The one or more through holes 208 are configured to allow passageof a processing gas through the gas distribution plate 138, and into theprocessing region.

FIG. 3A illustrates a top view of the gas distribution plate 138,according to one embodiment. As shown, the showerhead assembly 150further includes one or more temperature detection assemblies 250. Inone embodiment, the one or more temperature detection assemblies 250 arecoupled to the top surface 204 of the gas distribution plate 138. Theone or more temperature detection assemblies 250 are configured tomonitor a temperature of the gas distribution plate 138 duringprocessing. Each temperature detection assembly 250 includes a protrudedfeature 252 and a temperature probe 256. The protruded feature 252 ispositioned in contact with the top surface 204 of the gas distributionplate 138. The protruded feature 252 may be formed from a similarmaterial or the same as the gas distribution plate 138. For example, inone embodiment, the protruded feature 252 is formed from silicon, andthe gas distribution plate 138 is formed from silicon. Forming theprotruded feature 252 from a material similar to or the same as that ofthe gas distribution plate 138, allows enhanced heat transfer from thegas distribution plate 138 up through the protruded feature 252 to thetemperature probe 256, thus increasing the accuracy of the temperaturereading. In another example, the protruded feature 252 may be formedfrom a material having good thermal conductivity that is different thanthat of the gas distribution plate 138. For example, the protrudedfeature 252 may be formed from but not limited to aluminum, stainlesssteel, silicon carbide, aluminum nitride, and the like.

The temperature detection assemblies 250 may be selectively positionedon the gas distribution plate 138. For example, the temperaturedetection assemblies 250 may be positioned in an array about a center ofthe gas distribution plate 138. One temperature detection assembly 250may be disposed through openings, 228, 272 formed through a centerlineof the In the embodiment depicted in FIG. 3A, the temperature detectionassemblies 250 are arranged in a grid pattern or a polar array about acenterline of the gas distribution plate 138, and in one example,centerlines 282 of the temperature detection assemblies 250 are spacedequidistantly apart. In another example, the temperature detectionassemblies 250 are arranged in a ring that is concentric with the centerof the gas distribution plate 138. Generally, the temperature detectionassemblies 250 may be positioned on the gas distribution plate 138 inone or more through hole depleted areas 290. Hole depleted areas 290 areregions of the gas distribution plate 138 that do not have any gasthrough holes 208 formed therethrough. Positioning the temperaturedetection assemblies 250 in the through hole depleted areas 290 preventsthe temperature detection assemblies 250 form interfering with theuniform process gas distribution into the process region.

The protruded feature 252 includes an elongated body having a topsurface 258 and a bottom surface 260. The bottom surface 260 of theprotruded feature 252 is interfaced with the top surface 204 of the gasdistribution plate 138. In one embodiment, the protruded feature 252 maybe thermally coupled to the top surface 204 by bonding the bottomsurface 260 to the top surface 204 using a high thermal conductionmaterial, thus creating a thermal bond 280. For example, the highthermal conduction material may be formed from but not limited toaluminum, titanium, a nickel-cobalt ferrous alloy, such as KOVAR®, andthe like. In another embodiment, the protruded feature 252 may beintegrally formed (i.e., formed as a homogeneous unitary body) are partof the gas distribution plate 138. For example, the protruded feature252 and the gas distribution plate 138 may be a single unitary body. Thethermal bond 280 between the gas distribution plate 138 and each of theone or more temperature detection assemblies 250 ensures fast andreliable detection of changes in temperature of the gas distributionplate 138 by the temperature probe 256.

Optionally, at least a portion of the at least one of the protrudedfeatures 252 extending above the upper (top) surface 222 of the chillplate 151 has a threaded section 262. The threaded section 262 allows anut 264 to be threaded onto the threaded section 262 of the protrudedfeature 252 that is thermally bonded to the gas distribution plate 138to compress resilient energy storage structure 266. The resilient energystorage structure 266 may be a compression spring, a coil spring, a flatspring form, a Belleville washer (i.e., a conical spring washer), aresilient elastomer or other force generating device/structure. Theenergy storage structure 266, when compressed by the nut 264, axiallyloads the protruded feature 252 to compress the chill plate 151, the gasplate 139 and the gas distribution plate 138 together as shown bycompression arrows 268. Advantageously, since the gas plate 139 and thegas distribution plate 138 are urged together by the axial loading bythe compressed energy storage structure 266, a region 270 of interfacebetween the gas plate 139 and the gas distribution plate 138 adjacentthe protruded feature 252 is maintained in close physical contact, thusensuring that the temperature sensed by the temperature probe 256through the protruded feature 252 is an accurate reading of the regionof the gas distribution plate 138 adjacent the probe 256 rather than apinpoint reading only representative of the temperature directly belowthe protruded feature 252. It is contemplated that the protruded feature252 may be axially loaded in other manners to provide good compressionbetween the gas plate 139 and the gas distribution plate 138 adjacentthe protruded feature 252.

In one example, one or more or even all of the protruded features 252,each interfaced with a respective temperature probe 256, are axiallyloaded. In other examples, some of the protruded features 252 comprisingthe array may not be interfaced with a temperature probe 256, and one ormore or even all of the temperature probe-less protruded features 252(i.e., not interfaced with a temperature probe 256), are axially loaded.The array of axially loaded protruded features 252, probe-less or not,further ensure greater surface area of the gas plate 139 and the gasdistribution plate 138 are clamped together in close physical contact,thus promoting temperature uniformity laterally across the gasdistribution plate 138 even when exposed to plasma conditions in use. Insummary, at least a first protruded feature 252 included in the array ofthe protruded features 252 includes the temperature probe 256, and thefirst protruded feature 252 may be axially loaded or not axially loaded.Protruded features 252 other than the first protruded feature 252included in the array of the protruded features 252 may or may notinclude a temperature probe 256, and may or may be axially loaded.

Continuing to refer to FIG. 2, the top surface 258 is opposite thebottom surface 260. The top surface 258 is configured to support thetemperature probe 256. For example, in one embodiment a probe support254 may be formed in the top surface 258 of the protruded feature 252.The probe support 254 may be an opening formed through the protrudedfeature 252 such that the temperature probe 256 is slideably positionedtherein. In the example depicted in FIG. 2, the probe support 254 is across-hole formed through the protruded feature 252. In another example,the probe support 254 is a hole formed coaxially or parallel to thecenter axis of the protruded feature 252, such as, for example, a blindhole formed in the top surface 258 of the protruded feature 252 thatallows the temperature probe 256 to be positioned inside the protrudedfeature 252 and at least partially below the chill plate 151 and closerto the gas distribution plate 138.

FIG. 3B illustrates a top view of the gas distribution plate 138,according to another embodiment. In the embodiment shown, the showerheadassembly 150 includes a temperature detection assembly 300. Thetemperature detection assembly 300 is substantially similar to thetemperature detection assembly 250. The temperature detection assemblyincludes one or more protruded features 302. Each of the one or moreprotruded features has a ring shaped body 304 that is concentric withthe gas distribution plate 138. For example, FIG. 3B illustrates a firstprotruded feature 302 ₁ having a first radius r₁ (measured from thecenter of the gas distribution plate 138) and a second protruded feature302 ₂ having a second radius r₂. The first radius r₁ is less than aradius, R, of the gas distribution plate 138. The second radius r₂ isless than the first radius r₁. Additionally, the one or more protrudedfeatures 302 are positioned on the gas distribution plate 138 in one ormore through hole depleted areas 306. Positioning the one or moreprotruded features 302 in through hole depleted areas 306 ensures thatthe processing gas is evenly distributed into the processing region.

Conventional temperature monitoring systems employ a component embeddedin the gas distribution plate. Embedding such components therein,however, can result in thermal inconsistencies in the base components(i.e., the gas distribution plate) having a thermal mismatch within thebodies of the gas distribution plate. Having the protruded feature 252extending from the gas distribution plate 138, rather than embeddedtherein, such as that disclosed herein, ensures thermal homogeneity ofthe gas distribution plate 138.

The temperature detection assembly 300 may further include one or moreprobe support members 308 integrally formed with the one or moreprotruded features. The probe support members 308 may be formed from thesame material as the one or more protruded features 302. Each probesupport member 308 is configured to support a temperature probe 256.Each probe support member 308 is positioned such that the temperatureprobe 256 can be support over and above the chill plate 151.

Referring back to FIG. 2, the gas plate 139 includes a body 210 having atop surface 212 and a bottom surface 214. The bottom surface 214 ispositioned over the top surface 204 of the gas distribution plate 138such that substantially no gap is formed between the gas plate 139 andthe gas distribution plate 138. The gas plate 139 includes one of moregas passages 218 and one or more gas delivery channels 220. The one ormore gas passages 218 allow for the delivery of process gas from a gassource into the processing chamber. The one or more gas deliverychannels 220 extend from the one or more gas passages 218 to the bottomsurface 214 of the gas plate 139, allowing gas to flow from the one ormore gas passages 218 and into the one or more through holes 208, andinto the processing region. The gas plate 139 further includes openings272 formed through the body 210. The openings 272 allow the protrudedfeatures 252 coupled to the gas distribution plate 138 to extendtherethrough. Each of the openings 272 has a diameter such that theprotruded feature 252 does not contact the gas plate 139. Such contactcan lead to contamination in the temperature readings of the temperatureprobe 256.

The chill plate 151 includes a body 216 having a top surface 222 and abottom surface 224. The bottom surface 224 is positioned over to the topsurface 212 of the gas plate 139. The chill plate 151 is configured toregulate the temperature of the gas distribution plate 138 duringprocessing. For example, the chill plate 151 may include one or moretemperature control channels 226 formed therethrough such that atemperature control fluid may be provided therein to regulate thetemperature of the gas distribution plate 138. The chill plate 151further includes one or more openings 228 formed therethrough. The oneor more openings 228 allow the protruded features 252 coupled to the gasdistribution plate 138 to extend therethrough. Each of the one or moreopenings 228 has a diameter such that the protruded feature 252 does notcontact the chill plate 151. Such contact can led to contamination inthe temperature readings of the temperature probe.

In the embodiment shown in FIG. 2, the temperature detection assembly250 may further include an insulative sleeve 240 at least partiallysurrounding the probe support 254 (or probe support member 308 in FIG.3). The insulative sleeve 240 may be fabricated from a polymer or othersuitable material. The insulative sleeve 240 is configured to insulatethe temperature detection assembly 250 from the chill plate 151 and thegas plate 139. For example, in the embodiment shown in FIG. 2, theinsulative sleeve 240 extends downwards, into the opening 228 of thechill plate 151 and the opening 272 of the gas plate 139, such that theinsulative sleeve 240 completely surrounds the portion of thetemperature detection assembly 250 that is within the openings 272 and228.

FIG. 4 illustrates a top view of the showerhead assembly 150, accordingto one embodiment. As shown in FIG. 4, the one or more temperaturedetection assemblies 250 are positioned on the gas distribution plate138. The one or more temperature detection assemblies 250 extend throughthe gas plate 139 and the chill plate 151, such that the temperatureprobe 256 is supported above the chill plate 151. Once positioned in theprobe support 254, the temperature probe 256 is configured to measurethe temperature of the gas distribution plate 138 by measuring the heattransferred up the protruded feature 252. The in-situ real-timetemperature monitoring of the gas distribution plate 138 providescritical temperature feedback that aids in maintaining stable processcontrol.

While the foregoing is directed to specific embodiments, other andfurther embodiments may be devised without departing from the basicscope thereof, and the scope thereof is determined by the claims thatfollow.

What is claimed is:
 1. A showerhead assembly, comprising: a gasdistribution plate having a top surface and a bottom surface; and one ormore temperature detection assemblies contacting the top surface of thegas distribution plate, each temperature detection assembly comprising:a protruded feature contacting the top surface of the gas distributionplate; and a temperature probe positioned in the protruded feature. 2.The showerhead assembly of claim 1, further comprising: a gas platehaving a top surface and a bottom surface, the gas plate having one ormore openings formed through the gas plate from the top surface and thebottom surface, the bottom surface of the gas plate is positioned overthe top surface of the gas distribution plate such that the protrudedfeature of each temperature detection assembly extends through theopening of the gas plate.
 3. The showerhead assembly of claim 2, furthercomprising: a chill plate having a top surface and a bottom surface, thechill plate having one or more openings formed from the top surface tothe bottom surface, the bottom surface of the chill plate is positionedover the top surface of the gas plate such that the protruded feature ofeach temperature detection assembly extends through the opening of thechill plate.
 4. The showerhead assembly of claim 3, wherein a topsurface of each protruded feature includes a probe support that isconfigured to support the temperature probe within the protruded featureand above the chill plate.
 5. The showerhead assembly of claim 1,wherein the showerhead assembly further comprises: one or moreinsulative sleeves, wherein each insulative sleeve at least partiallysurrounds the protruded feature.
 6. The showerhead assembly of claim 1,wherein the gas distribution plate includes a plurality of throughholes, the plurality of through holes arranged on the gas distributionplate in one or more zones.
 7. The showerhead assembly of claim 6,wherein the one or more temperature detection assemblies are positionedon the gas distribution plate in areas exterior to the one or morezones.
 8. The showerhead assembly of claim 1, wherein at least some ofthe protruded features are arranged in a ring concentric with the gasdistribution plate.
 9. The showerhead assembly of claim 1, wherein theprotruded feature of each temperature detection assembly and the gasdistribution plate is formed from a singular body.
 10. The showerheadassembly of claim 1, wherein at least one of the protruded features isaxially loaded to urge the gas distribution plate against the gas plate.11. The showerhead assembly of claim 1 further comprising: a protrudedfeature contacting the top surface of the gas distribution plate and notinterfaced with a temperature probe, the protruded feature axiallyloaded to urge the gas distribution plate against the gas plate.
 12. Aprocessing chamber, comprising: a substrate support member configured tosupport a substrate; and a showerhead assembly, comprising: a gasdistribution plate having a top surface and a bottom surface; and one ormore temperature detection assemblies interfaced with the top surface ofthe gas distribution plate, each temperature detection assemblycomprising: a protruded feature bonded to the top surface of the gasdistribution plate; and a temperature probe positioned in the protrudedfeature.
 13. The processing chamber of claim 12, further comprising: agas plate having a top surface and a bottom surface, the gas platehaving one or more openings formed through the gas plate from the topsurface and the bottom surface, the bottom surface of the gas plate ispositioned over the top surface of the gas distribution plate such thatthe protruded feature of each temperature detection assembly extendsthrough the opening of the gas plate.
 14. The processing chamber ofclaim 13, further comprising: a chill plate having a top surface and abottom surface, the chill plate having one or more openings formed fromthe top surface to the bottom surface, the bottom surface of the chillplate is positioned over the top surface of the gas plate such that theprotruded feature of each temperature detection assembly extends throughthe opening of the chill plate.
 15. The processing chamber of claim 14,wherein a top surface of each protruded feature includes a probe supportthat is configured to support the temperature probe above the chillplate.
 16. The processing chamber of claim 12, wherein the showerheadassembly further comprises: one or more insulative sleeves, wherein eachinsulative sleeve at least partially surrounds the protruded feature.17. The processing chamber of claim 12, wherein at least one of theprotruded features is axially loaded to urge the gas distribution plateagainst the gas plate.
 18. The processing chamber of claim 12 furthercomprising: a protruded feature contacting the top surface of the gasdistribution plate and not interfaced with a temperature probe, theprotruded feature axially loaded to urge the gas distribution plateagainst the gas plate.
 19. The processing chamber of claim 12, whereinat least some of the protruded features are arranged in a ringconcentric with the gas distribution plate.
 20. The processing chamberof claim 12, wherein the temperature detection assembly and the gasdistribution plate is formed from a singular body.
 21. A method ofprocessing a substrate, comprising: forming a plasma in a processingregion of a processing chamber defined between a showerhead assemblyhaving a gas distribution plate and a substrate support assemblyconfigured to support the substrate; detecting a temperature of theshowerhead assembly with a temperature detection assembly interfacedwith the top surface of the gas distribution plate such that a thermalbond is formed between the gas distribution plate and the temperaturedetection assembly, the temperature detection assembly comprising: aprotruded feature interfaced with the top surface of the gasdistribution plate; a temperature probe supported by the protrudedfeature, the temperature probe configured to monitor a temperature ofthe gas distribution plate; and adjusting a process recipe based on thetemperature monitored by the temperature detection assembly.
 22. Themethod of claim 21, further comprising: providing a temperature controlfluid to a chill plate positioned over the gas distribution plate inresponse to the temperature detected by the temperature detectionassembly.